FusionAP

FusionAP is a semiconductor business that focuses on outsourced assembly and test packaging.

AI infrastructure and computeRobotics and hardwareClimate and energy

FusionAP has no funding amount on record yet; its latest known round is Pre Seed (May 2026). Recent Funding first saw it on October 2, 2026.

Founders and team

• TC
  Teng Chow Ooi Founder

  source: crunchbase.com

Raise history

1. May 12, 2026
   Pre Seed · amount undisclosed
   Source: crunchbase.com

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Every amount links to the page it came from. How Recent Funding sources and verifies funding data. The same data as JSON: /api/v1/companies/fusionap.