Hangke Platinum Technology

Hefei Hangke Borui focuses on the R&D and production of advanced thermal barrier and high-temperature corrosion-resistant coatings.

Hangke Platinum Technology has no funding amount on record yet; its latest known round is Seed (Aug 2026). Recent Funding first saw it on October 2, 2026.

Raise history

1. August 13, 2026
   Seed · amount undisclosed
   Source: crunchbase.com

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Every amount links to the page it came from. How Recent Funding sources and verifies funding data. The same data as JSON: /api/v1/companies/hangke-platinum-technology.